TOYONOBU YOSHIDA, DR 
PROFESSOR IN PLASMA MATERIALS ENGINEERING
DEPARTMENT OF MATERERIALS ENGINEERING
GRADUATE SCHOOL OF ENGINEERING
THE UNIVERSITY OF TOKYO

DATE of BIRTH:

April 11, 1948

EDUCATION:

1972: Department of Metallurgy, Faculty of Engineering, The University of Tokyo: (BE)
1974: Department of Metallurgy & Materials Engineering, Graduate School of Engineering, The University of Tokyo: (MA)
1977: Department of Metallurgy & Materials Engineering, Graduate School of Engineering, The University of Tokyo

FULL TIME EMPLOYMENT:

1977: Research Associate, Faculty of Engineering, The University of Tokyo
1982: Assistant Professor, Faculty of Engineering, The University of Tokyo
1984: Associate Professor, Faculty of Engineering, The University of Tokyo
1989: Full Professor, Faculty of Engineering, The University of Tokyo

EDITORIAL BOARD:

J. Plasma Chem. and Plasma Processing
Plasma Sources: Science and Technology
J. Mater. Synthesis and Processing
J. Thermal Spray Technology
Science and Technology of Advanced Materials

CHAIRMAN:

1990 - 1996: JSPS-153 Committee on Plasma Materials Science
1997 - 1998: IUPAC Subcommittee on Plasma Chemistry

OTHERS:

General Secretary of ISPC-8 (Tokyo, 1987)
Member of IUPAC Subcommittee on Plasma Chemistry (1988 - 1998)
IUPAC Fellow (1999 -)

AWARDS:

1987: Paper Award (Japan Inst. of Metals).
1989: Achievement Award (Japan Inst. of Metals).
1992: Nishiyama Memorial Award (Iron and Steel Institute of Japan)
1994: Environment Award (The Nikkan Kogyo Shinbun, Ltd. & Environment Agency).
1996: Notable Invention Award: (Science and Technology Agency).
1996: Academic Award (The Ceramic Society of Japan).
2000: IUPAC Fellow.
2003: Masumoto Hakaru Award (Japan Inst. of Metals).
2004: Plasma Materials Science Award (JSPS-153 Committee)

PAPERS/PATENTS:

Papers:
Total citation ( - 1400)
Regular Issure: in English ( - 120), in Japanese ( - 30), Books (joint authors) (10)

Patents: - 25 (Japan), - 5 (International)

Full List is Here

RESEARCH FIELDS:

Thermal Plasma Processing
# Plasma Flash Evaporation (TPPVD)
# Thermal Plasma Chemical Vapor Deposition (TPCVD)
# Spraying/ Ultrafine Powder Synthesisi (Metal Alloys, Ceramics)
# Coatings (SiC, Si3N4, Diamond, High Tc Superconductor, SOFC, TBC)

Low Pressure Plasma Processing
# Low pressure ICP & Phase regulated bias sputtering (cBN, Diamond)

NOTABLE INVENTION:

Thermal Plasma Processing
1. DC-RF Hybrid Plasma System & RF-RF Hybrid Plasma System
2. Atmospheric Microwave Plasma Torch for Diamond Deposition
3. Preparation of Ultrafine Powders of Ceramics such as SiC, Si3N4, SiC-Si3N4 by DC-RF Hybrid Plasma System
4. Ultrafast Deposition of Ceramics such as SiC and Si3N4 by Thermal Plasma CVD
5. Cyclic Thermal Plasma Deposition System for Diamond and SiC.
6. Development of Flash Evaporation Method for High Tc Superconductor and SiC
7. Development of DC-RF Hybrid Plasma Spraying System for Ceramics & for SOFC and TBC
8. Ultrafast Deposition of Si Films for Solar Cells by Thermal Plasma CVD
9. Development of High Power Induction Plasma Torch for the Destruction of CFC and Other Gases
10. Development of High Power Induction Plasma Torch for the Radioactive Waste Destruction
11. Development of High Power Twin Hybrid Spray System for Novel TBC

Low Pressure Plasma Processing
1. Pure cBN Deposition by Phase Regulated Bias Sputtering
2. Pure cBN Deposition by Low Pressure ICP-CVD
3. Lower Pressure Deposition of Diamond by Low Pressure ICP-CVD

COMMENTS:

For the last 30 years, I have been engaged in studying plasma processing based on materials science, namely, plasma materials engineering. I started with the study of thermal plasma processing, especially plasma-particle interaction and co-condensation process of high temperature vapors, and then expanded to the ultrafine particle synthesis and to thermal plasma PVD, CVD and powder spraying for coating applications. 10 years ago, I also started to utilize medium pressure plasma with an aim at super-high rate deposition of pure silicon, and found that the peculiar characteristic of this plasma is suitably called “Meso-plasma” as a new category of plasmas. Looking back my research carrier, the research field would be characterized mainly by the words: plasma and vapor condensation, and is fortunately fit to the recent global trend of materials R&D which is shifting from “monolithic” to “materials
system” and from “bulk” to “thin film & coating”, although this was not the case 30 years ago.
It is, on the other hand, a clear consensus that the primary factor in materials development is “affordability” and it must be considered at every step in processing; unless otherwise, all the efforts are only for the sake of research. It is thus a natural consequence that the plasma processing, as an affordable and effective thin film & coating technology, is attracting global attentions in materials engineering. Unfortunately, however, the current plasma spray thin film & coating technology seems not yet to reach the sufficient level to meet the requirements from the fields where this technique was not applicable in the past. In fact, considering the present
status of all the thin film & coating related markets on the basis of this technology developed over the last thirty years and its future possible evolution, the rapidly growing desires, such as the next-generation thin film devices and nano-coatings, would not be fully gratified if the currently available technologies are only used. I suppose that I am not the only one who believes that new standpoints and principles with the fundamental research concept should be introduced from both plasma processing science and materials science & engineering perspectives.